EB13E2H2H-48.000M TR

EB13E2 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1.024MHz to 66.6666MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration ±100ppm Maximum over -20°C to +70°C ±50ppm Maximum over -20°C to +70°C ±25ppm Maximum over -20°C to +70°C ±20ppm Maximum over -20°C to +70°C ±100ppm Maximum over -40°C to +85°C ±50ppm Maximum over -40°C to +85°C ±25ppm Maximum over -40°C to +85°C ±20ppm Maximum over -40°C to +85°C 3.3Vdc ±5% Supply Voltage Input Current Load Drive Capability 3mA Maximum over Nominal Frequency of 1.024MHz to 9.999999MHz 4mA Maximum over Nominal Frequency of 10MHz to 19.999999MHz 5mA Maximum over Nominal Frequency of 20MHz to 39.999999MHz 6mA Maximum over Nominal Frequency of 40MHz to 50MHz 9mA Maximum over Nominal Frequency of 50.000001MHz to 66.6666MHz IOH = -4mA 90% of Vdd Minimum IOL = +4mA 10% of Vdd Maximum Measured at 20% to 80% of waveform 5nSec Maximum over Nominal Frequency of 1.024MHz to 24MHz 4nSec Maximum over Nominal Frequency of 24.000001MHz to 50MHz 3nSec Maximum over Nominal Frequency of 50.000001MHz to 66.6666MHz Measured at 50% of Waveform 50 ±5(%) 15pF Maximum Output Logic Type CMOS Logic Control / Additional Output Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) 80% of Vdd Minimum or No Connect to Enable Output, 20% of Vdd Maximum to Disable Output (High Impedance) Standby Current Start Up Time Disabled Output: High Impedance 10µA Maximum Fj = 12kHz to 20MHz 1pSec Maximum 10mSec Maximum Storage Temperature Range -55°C to +125°C Output Voltage Logic High (VOh) Output Voltage Logic Low (VOl) Rise/Fall Time Duty Cycle RMS Phase Jitter Revised O: 12/5/2014 Page 2 of 12 www.ecliptek.com EB13E2 Series PART NUMBERING GUIDE Revised O: 12/5/2014 Page 3 of 12 www.ecliptek.com EB13E2 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN 1 CONNECTION Tri-State 2 Case/Ground 3 Output 4 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised O: 12/5/2014 Page 4 of 12 www.ecliptek.com EB13E2 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised O: 12/5/2014 Page 5 of 12 www.ecliptek.com EB13E2 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass Capacitor close to the package ground and VDD pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) Passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. Revised O: 12/5/2014 Page 6 of 12 www.ecliptek.com EB13E2 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised O: 12/5/2014 Page 7 of 12 www.ecliptek.com EB13E2 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised O: 12/5/2014 Page 8 of 12 www.ecliptek.com EB13E2 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised O: 12/5/2014 Page 9 of 12 www.ecliptek.com